The RG82000 series consists of a FSW welded coldplates.

Our FSW fabrication method allows an easy adaptation to the most demanding application requirements with a higher reliability with a joint-free monolithic body.

With the cooling circuit integrated on its body and FSW welded its reliability against accidental leaks is very high, the only joints are in the entrance and exit of the fluid circuit. With our FSW welded fabrication method a high customization of the cooling circuit is achieved yelding to high performance and module oriented circuits whilst mantaining a low pressure drop.

Highlights:

• Liquid cooling
• High performance and optimization
• High reliability of fluid circuit
• Low pressure losses
• High thermal dissipation
• Custom designs under request

Liquid cooling heatsinks with specific design of internal channel for each power module, considering the internal situation of the power chips. The circuit has been optimized for an homogeneous distribution of the heat. Manufactured in copper or aluminium can be adapted to the customer requirements.

These heatsinks are specially suited for cooling of high power converters. RG7803xAL and RG7803xCU range is PrimePACK™3 specific while RG7823xAL and RG7823xCU can be used for IHV/IHM modules from other manufacturers.

Highlights:

• IHV /IHM / PrimePACK™ optimized designs
• Liquid cooling
• High thermal dissipation
• Copper or aluminium heatsinks
• Custom designs under request

The RG77000 series consists of a sandwich structure of 2 pieces on a cooling coil.

This structure allows easy adaptation to the requirements of the application and allows to combine different materials (for example, aluminum – copper).

As the cooling circuit is done with a single curved tube the reliability against accidental leaks is very high, because there are only joints in the entrance and exit of the fluid circuit.

Tube diameters are standardized to Ø8 mm and Ø10 mm., which allows standardizing the production process and offer a competitive cost.

The possible surface dimensions range start from 25cm2 to over 1800cm2, which can be overcome in multi circuit design.

The operating temperature limits are 0 ° C to 120 ° C., but there is the possibility of special applications for high temperatures and high thermal cycles (from -50ºC to 350ºC) with RG77000HTC special series (consult to factory).

Highlights:

• Low weight
• Liquid cooling
• Low pressure losses
• High reliability of fluid circuit
• High thermal dissipation
• Custom designs under request

Machined heatsinks with internal liquid cooling circuit. Suited for mounting of any 62 mm IGBT or thyristor power modules in places where liquid cooling system is available.

Especially designed to use modules of 62mm, E3-Pack or EconoPACK™ over RG7600 Series, Furthermore, this type of heatsink was designed with the proposed of increase the power and reduce the dimensions of the power designs.

Highlights:

• Optimized design for IGBT and SCR modules
• Liquid cooling
• Nickel plated finish
• High thermal dissipation
• Custom designs under request

This type of heatsinks are suited for the mounting of liquid cooled Press-Pack devices power stacks. We have various standard types depending on device pole face diameter. RG75105 up to 25 mm, RG75106 up to 47 mm, RG75108 up to 73 mm and RG75110 up to 100 mm.

Highlights:

• Optimized design for Press-Pack modules
• Versions with power terminal available
• Liquid cooling
• High termal dissipation
• Custom designs under request