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offers you


NeoGraf Thermal Interface Pads


Power Semiconductor Cooling

Customized Applications

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NeoGraf HITHERM™ HT-C3200

e-guasch.com Dau Heatpipes
by NeoGraf
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AET Thermal Interface Pads for Power Electronics
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Thermal Interface Pads for Power Electronics

Dispense-Free Manufacturing

● Pad form factor
● Easily integrates into any size production line
● Eliminate re-torque process to prevent torque loss


Reliable, Consistent Thermal Performance

● Unaffected by extreme temperatures
● Unlimited performance lifetime


Residue-Free Repairs

● Eliminates grease clean-up and application
processes required to replace failed modules


Environtmentally friendly

● RoHS, REACH compliant
● Contains no hazardous materials
● Chemically inert to almost any substance
● Easy disposal of waste

For more information, please contact us.

HITHERM™ HT-C3200 Thermal Interface Material (TIM)

HITHERM™ HT-C3200 Thermal Interface Material (TIM) is the first of its kind, compressible graphite sheet with thermal performance that matches traditional thermal grease without pump-out and dry-out failure modes.
This breakthrough material was developed to address the reliability challenges of mission critical applications in extreme temperature environments and harsh duty cycles

HT-C3200 TIM Portfolio

Most popular thermal interfaces shown below.

EconoDUAL™ and PrimePACK™ are registered trademarks of Infineon Technology AG, Germany.