RGCK series

Standard Clamps for Press-Pack Semiconductor Assembly

The RGCK series represents our standard range of clamps for the assembly of double-sided cooled Press-Pack semiconductors. Designed to provide precise, repeatable and safe clamping force, it offers a robust and reliable solution for industrial power electronics applications.

Key Features
  • High reliability in demanding industrial applications.
  • Corrosion protection through RoHS-compliant zinc plating.
  • Uniform clamping force distribution.
  • Simple and safe installation.
  • Electrical insulation: 2,500 VRMS / 1 min.
  • Clamping force range available up to 6,500 kgf.
  • Compatible with semiconductor devices from Ø57 mm to Ø125 mm.
  • Clamping force tolerance: -5% / +10%.
Press-pack mounting example


Clamping example with RGCK series.

Experience and Mechanical Reliability

Backed by extensive experience in the design and manufacture of these systems, our clamps are developed according to strict criteria of mechanical robustness and precise force control.

Each assembly is designed, manufactured and calibrated to ensure uniform pressure distribution, accurate mechanical alignment and long-term stability.

The result is a reliable and proven solution, engineered to operate in the most demanding industrial environments.

Semiconductor performance and protection

In Press-Pack devices, the correct application of clamping force is a critical factor that directly influences both electrical performance and thermal dissipation.

The precision of the clamping system minimizes risks associated with excessive or insufficient contact pressure, reducing premature failures and ensuring stable operation in demanding industrial applications.

Our experience in power electronics enables us to understand these requirements and develop solutions tailored to high-reliability and mission-critical environments.

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