RGAPxFx series

Very High-Pressure Clamps for Press-Pack Semiconductors

The RGAPxFx series represents our highest-pressure range of clamps for the assembly of double-sided cooled Press-Pack semiconductors and multi-device configurations. Designed for applications with extreme mechanical and thermal requirements, it provides a robust, precise and highly reliable solution for demanding industrial power electronics systems.

Key Features
  • Very high-pressure design for the most demanding applications.
  • Suitable for double-sided cooling configurations and multi-device assemblies.
  • Precise force application through a central pre-calibrated pressure indicator.
  • Uniform clamping force distribution.
  • Robust construction for maximum mechanical reliability.
  • Electrical insulation greater than 10,000 VRMS.
  • Clamping force range available up to 140 kN.
  • Available in eight standard rod spacing configurations.
  • Safe and repeatable installation for critical applications.
Press-pack mounting example


Clamping example with RGCK series.

Experience and Mechanical Reliability

Backed by extensive experience in the design and manufacture of these systems, our clamps are developed according to strict criteria of mechanical robustness and precise force control.

Each assembly is designed, manufactured and calibrated to ensure uniform pressure distribution, accurate mechanical alignment and long-term stability.

The result is a reliable and proven solution, engineered to operate in the most demanding industrial environments.

Semiconductor performance and protection

In Press-Pack devices, the correct application of clamping force is a critical factor that directly influences both electrical performance and thermal dissipation.

The precision of the clamping system minimizes risks associated with excessive or insufficient contact pressure, reducing premature failures and ensuring stable operation in demanding industrial applications.

Our experience in power electronics enables us to understand these requirements and develop solutions tailored to high-reliability and mission-critical environments.

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