RGCD series

Single-Sided Clamps for Press-Pack Semiconductors

The RGCD series has been designed as a compact and reliable solution for the assembly of single-sided Press-Pack semiconductors in power electronics applications. Its pre-calibrated pressure system, combined with a robust design and high-performance electrical insulation, ensures uniform clamping force distribution and easy integration into industrial equipment.

Key Features
  • High reliability in demanding industrial applications.
  • Corrosion protection through RoHS-compliant zinc plating.
  • Uniform clamping force distribution.
  • Simple and safe installation.
  • Electrical insulation of 5,000 VRMS / 1 min.
  • Clamping force range available up to 4,800 kgf.
  • Clamping force tolerance: -5% / +10%.
  • Wide range of configurations available to suit different package sizes and force requirements.
Press-pack mounting example


Clamping example with RGCK series.

Experience and Mechanical Reliability

Backed by extensive experience in the design and manufacture of these systems, our clamps are developed according to strict criteria of mechanical robustness and precise force control.

Each assembly is designed, manufactured and calibrated to ensure uniform pressure distribution, accurate mechanical alignment and long-term stability.

The result is a reliable and proven solution, engineered to operate in the most demanding industrial environments.

Semiconductor performance and protection

In Press-Pack devices, the correct application of clamping force is a critical factor that directly influences both electrical performance and thermal dissipation.

The precision of the clamping system minimizes risks associated with excessive or insufficient contact pressure, reducing premature failures and ensuring stable operation in demanding industrial applications.

Our experience in power electronics enables us to understand these requirements and develop solutions tailored to high-reliability and mission-critical environments.

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