RGAP series

High-Pressure Clamps for Press-Pack Semiconductors

The RGAP series represents our range of high-pressure clamps for the assembly of double-sided cooled Press-Pack semiconductors and multi-device configurations. Designed for applications with demanding mechanical and thermal requirements, it provides a robust, precise and reliable solution for industrial power electronics systems.

Key Features
  • High-pressure design for demanding industrial applications.
  • Suitable for double-sided cooling configurations and multi-device assemblies.
  • Precise force application through a central pre-calibrated pressure indicator.
  • Uniform clamping force distribution.
  • Robust construction for maximum mechanical reliability.
  • Electrical insulation available up to 8,000 VRMS.
  • Clamping force range available up to 9,000 kgf.
  • Compatible with different mounting configurations using insulating or fibre tubes.
  • Safe and repeatable installation for critical applications.
Press-pack mounting example


Clamping example with RGCK series.

Experience and Mechanical Reliability

Backed by extensive experience in the design and manufacture of these systems, our clamps are developed according to strict criteria of mechanical robustness and precise force control.

Each assembly is designed, manufactured and calibrated to ensure uniform pressure distribution, accurate mechanical alignment and long-term stability.

The result is a reliable and proven solution, engineered to operate in the most demanding industrial environments.

Semiconductor performance and protection

In Press-Pack devices, the correct application of clamping force is a critical factor that directly influences both electrical performance and thermal dissipation.

The precision of the clamping system minimizes risks associated with excessive or insufficient contact pressure, reducing premature failures and ensuring stable operation in demanding industrial applications.

Our experience in power electronics enables us to understand these requirements and develop solutions tailored to high-reliability and mission-critical environments.

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