MTH Modular Series designed for high power systems up to 700 kW. Modular (1/2B2IC) simplifying the assembly of B2I/half bridge, B6I, B8I or back-to-back topologies by stacking modules. Current, voltage and temperature sensors in a single connector interface. Optical interfaces also available. Highlights:
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MTH Series designed for high power systems up to 700 kW. B6I and B2I topologies with high power IGBT modules. Current, voltage and temperature sensors included along sensor concentrator-adaptator board. Optical interface also available. Highlights:
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IGBT assemblies in press pack format. Press pack IGBTs reduce the explosion risk, improve power cycling performance as well as provide better short circuit behaviour compared with modules. Also the stray inductance in both gate and emmitter connections is reduced. SP stacks are built with 2500V & 4500V IGBTs, suitable for wide range of high power IGBT assemblies. Highlights:
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