Liquid Cooled

With tight collaboration with our customers, we can design and produce almost any kind of copper or aluminium liquid cooled heatsink (other materials on demand). Our designs take in consideration the internal situation of the power chips and an especific water circuit is designed for the optimal refrigeration of the power module. Do not hesitate to ask for your application needs.

Copper and aluminium liquid cooled heatsinks with internal channel for semiconductor cooling through water, glycol and/or oil. Appropriate for high power converters in industrial facilities with cooling circuit systems and heat exchangers. We have a standard range and we can customise any design you require. The new RG82000 series implements new fabrication FSW technology for a very reliable and high performace coldplates. RG78000 series has been specially designed for IHM/IHV y PrimePACK™3 modules. RG77000 as a low cost solution with inserted cooling circuit. RG75000 series for press-pack devices and RG76000 for 62 mm completes the standard product range from our company.

The RG82000 series consists of a FSW welded coldplates. Our FSW fabrication method allows an easy adaptation to the most demanding application requirements with a higher reliability with a joint-free monolithic body. With the cooling circuit integrated on its body and FSW welded its reliability against accidental leaks is very high, the only joints are in the entrance and exit of the fluid circuit. With our FSW welded fabrication method a high customization of the cooling circuit is achieved yelding to high performance and module oriented circuits whilst mantaining a low pressure drop. 

Liquid cooling heatsinks with specific design of internal channel for each power module, considering the internal situation of the power chips. The circuit has been optimized for an homogeneous distribution of the heat. Manufactured in copper or aluminium can be adapted to the customer requirements. 

The RG77000 series consists of a sandwich structure of 2 pieces on a cooling coil. This structure allows easy adaptation to the requirements of the application and allows to combine different materials (for example, aluminum – copper). 

Machined heatsinks with internal liquid cooling circuit. Suited for mounting of any 62 mm IGBT or thyristor power modules in places where liquid cooling system is available. 

This type of heatsinks are suited for the mounting of liquid cooled Press-Pack devices power stacks. We have various standard types depending on device pole face diameter. RG75105 up to 25 mm, RG75106 up to 47 mm, RG75108 up to 73 mm and RG75110 up to 100 mm.