Highlights B6C, B6U, W3C topologies. M1U under requirement. Standard range. Datasheet by type. Compact design. Ready to connect.

Thyristor and diode modular system with high reliability thanks to the construction with press-pack devices. Standard types available (and possibility of customizing), optimized and codified, natural or forced cooling, this series includes tested protection (thermal switch, ultrarapid fuses and RC network). You can get from this series a complete industrial rectifier, ready to use.

Back to: Power stacks with press-pack devices

B6C

	reference	IRMS max./IN ADC	VRRM	cooling	dimensions [mm]	pdf
	TQ-B6C1150F12RCVTF	1150 A	1200 V	forced	375x660x577
	TQ-B6C1650F12RCVTF	1650 A	1200 V	forced	375x660x577
	TQ-B6C2350F12RCVTF	2350 A	1200 V	forced	375x660x577

B6U

	reference	IRMS max./IN ADC	VRRM	cooling	dimensions [mm]	pdf
	TQ-B6U2015F12RCVTF	2015 A	1200 V	forced	375x660x577
	TQ-B6U2750F12RCVTF	2750 A	1200 V	forced	375x660x577
	TQ-B6U2750F20RCVTF	2750 A	2000 V	forced	375x660x577
	TQ-B6U3375F12RCVTF	3375 A	600 V	forced	375x660x577
	TQ-B6U3545F12RCVTF	3545 A	1200 V	forced	375x660x577

W3C

	reference	IRMS max./IN ADC	VRRM	cooling	dimensiones [mm]	pdf
	TQ-W3C0930F12RCVTF	930 A	1200 V	forced	375x660x577
	TQ-W3C1560F12RCVTF	1560 A	1200 V	forced	375x660x577

Back to: Power stacks with press-pack devices