INSULATED BASE PLATE POWER MODULES

Power stacks mounted with semiconductors encapsulated in the industry standard power modules. This type of stacks are easy to connect and compact designed. All technologies available, IGBT, MOSFET, thyristor and diode.

PRESS-PACK DEVICES

Power stacks mounted with press-pack devices. Compact designs with IGBTs, thyristors and diodes.

ENCAPSULATED BRIDGE RECTIFIERS

Power stacks mounted with multichip modules, habitually 1~ and 3~ bridge rectifiers. DIN rail series available.

SCREW TYPE DEVICES

Power stacks mounted with screw type devices. Available diodes and thyristors, allows the construction of cheap and robust rectifiers.

PRESS-FIT DIODES

Power stacks mounted with press-fit diodes, these diodes are directly fitted on aluminium plates.