dau-background-slidersSlide thumbnail
GUASCH
offers you

THERMAL
SOLUTIONS

NeoGraf Thermal Interface Pads

HITHERM™ HT-C3200

Power Semiconductor Cooling

Customized Applications

dau-background-slidersSlide thumbnail

NeoGraf HITHERM™ HT-C3200

e-guasch.com Dau Heatpipes
HT-C3200
by NeoGraf
Contact us!

Need more information about this product?

AET Thermal Interface Pads for Power Electronics
Contact us!

HITHERM™ HT-C3200

Thermal Interface Pads for Power Electronics

Dispense-Free Manufacturing

● Pad form factor
● Easily integrates into any size production line
● Eliminate re-torque process to prevent torque loss

 

Reliable, Consistent Thermal Performance

● Unaffected by extreme temperatures
● Unlimited performance lifetime

 

Residue-Free Repairs

● Eliminates grease clean-up and application
processes required to replace failed modules

 

Environtmentally friendly

● RoHS, REACH compliant
● Contains no hazardous materials
● Chemically inert to almost any substance
● Easy disposal of waste

For more information, please contact us.

HITHERM™ HT-C3200 Thermal Interface Material (TIM)

HITHERM™ HT-C3200 Thermal Interface Material (TIM) is the first of its kind, compressible graphite sheet with thermal performance that matches traditional thermal grease without pump-out and dry-out failure modes.
This breakthrough material was developed to address the reliability challenges of mission critical applications in extreme temperature environments and harsh duty cycles

HT-C3200 TIM Portfolio

Most popular thermal interfaces shown below.

EconoDUAL™ and PrimePACK™ are registered trademarks of Infineon Technology AG, Germany.